Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
AMB, DBC, DPC Inspection Product Line
DBC001 Warpage/Thickness Inspection Equipment
This warpage/thickness inspection equipment is specifically designed for advanced ceramic substrates such as DBC and AMB. It utilizes a high-precision fitting stage and multi-point measurement comparison to achieve fast and accurate warpage and thickness inspection. The equipment offers ultra-high measurement accuracy and an extremely low misjudgment rate, effectively enhancing production line quality control.
Product Advantages
High-Precision Measurement：Employs high-resolution profile acquisition technology with 3200 points per profile, 12μm resolution on the XY axes, and 3.6μm accuracy on the Z axis, ensuring accurate capture of subtle deformations and thickness variations.
Low Misjudgment Rate：Overkill rate as low as 0.01% and miss rate as low as 0.001%, significantly reducing false positives and missed detections, improving yield and efficiency.
High-Efficiency Inspection：Inspection time of only 10 seconds per piece (for products sized 30-100mm), meeting production line takt time and improving inspection efficiency.
Wide Applicability：Compatible with various types of DBC and AMB substrates, supporting multiple sizes and shapes to flexibly adapt to diverse production needs.
Intelligent Data Analysis：Automatically compares the fitting stage and measurement points, rapidly outputting height difference data, and supporting integration into automated production lines.
Product Functions
Product Specifications
- Inspection Object：
- Warpage/Thickness
- Profiles per Point：
- 3200
- XY Axis Resolution：
- 12μm
- Z Axis Accuracy：
- 3.6μm
- Overkill Rate：
- 0.01%Varies by defect type
- Miss Rate：
- 0.001%Varies by defect type
- Inspection Efficiency：
- 10 sec/pieceFor products sized 30-100mm
Applications
DBC Substrate Inspection：Used for warpage and thickness measurement of direct bonded copper ceramic substrates to ensure packaging reliability.
AMB Substrate Inspection：Applied to quality control of active metal brazed ceramic substrates, ensuring the performance of power electronics modules.
Advanced Ceramic Components：Suitable for online inspection of ceramic substrates such as aluminum nitride and alumina, supporting semiconductor packaging and IGBT module manufacturing.
Production Line Quality Monitoring：Integrated into automated production lines to monitor warpage and thickness indicators in real time, improving overall yield.