Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
Thin-Film Circuit Inspection System
待定 Thin-Film Circuit Inspection System
This system is specifically designed for visual defect inspection of high-precision thin-film circuits on ceramic substrates. It employs a high-resolution imaging system to achieve precise detection with pixel accuracy of 1 μm and repeatability of ±1 μm. It can automatically identify defects such as circuit continuity, missing, excess metal, misalignment, and contamination, while simultaneously performing dimensional measurement, providing efficient and reliable quality assurance for advanced ceramic components.
Product Advantages
High-Precision Inspection：The system achieves a maximum pixel accuracy of 1 μm and repeatability of ±1 μm, enabling precise identification of micron-level defects to meet demanding ceramic circuit manufacturing requirements. It supports adjustable accuracy levels to accommodate different product needs.
Comprehensive Defect Coverage：The system can detect over ten defect types, including circuit continuity, missing, excess metal, misalignment, contamination, foreign matter, burrs, color deviation, serration, and edge chipping, while also performing dimensional measurement to ensure product quality.
Ultra-High Inspection Performance：With an over-kill rate of only 0.1% and a miss rate as low as 0.01%, it significantly reduces false positives and misses while maintaining inspection quality, effectively lowering production costs.
High-Speed Inspection：For a 2-inch product, the inspection time per unit is only 5 seconds, making it suitable for high-volume production cycles and enhancing overall line efficiency.
Smart Data Export：The system can automatically generate new DXF files from recognized images, enabling customers to perform data traceability, process optimization, and subsequent analysis, ensuring seamless integration between inspection and manufacturing.
Product Functions
Product Specifications
- Inspection Target：
- Thin-film circuitsHigh-precision circuits on ceramic substrates
- Maximum Accuracy：
- Pixel accuracy: 1 μm, repeatability: ±1 μmAdjustable accuracy levels supported
- Standard Accuracy：
- Pixel accuracy: 3 μm, repeatability: ±3 μmThe following data is calculated based on standard accuracy
- Inspection Items：
- Circuit continuity, missing, excess metal, misalignment, contamination, foreign matter, burrs, color deviation, serration, edge chipping, etc.Supports DXF export of recognized images
- Over-kill Rate：
- 0.1%
- Miss Rate：
- 0.01%
- Inspection Speed：
- 5 sec/pieceExample based on a 2-inch product
Applications
Ceramic Substrate Thin-Film Circuits：Suitable for visual defect inspection and dimensional measurement of high-precision thin-film circuits formed on ceramic substrates by sputtering and photolithography processes.
Advanced Ceramic Components：Used for circuit pattern inspection in advanced ceramic components to ensure product performance and reliability.
Semiconductor Package Substrate Inspection：In the semiconductor packaging field, it enables high-speed inspection of fine circuits on ceramic package substrates to meet high-reliability requirements.
Microelectronics Device Manufacturing：Applied to quality control of thin-film circuits in microelectronics device manufacturing, helping to improve yield and production efficiency.