Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
HTCC / LTCC Green Tape Product Line
ME3555 Large-Size Green Sheet Appearance Inspection Equipment
The ME Large-Size Green Sheet Appearance Inspection Equipment is specifically designed for green sheets used in electrostatic chucks and probe cards. It covers full inspection for through-holes, via filling, and printing processes, supporting large-size sheets from 350 to 550 mm. With sub-micron precision, it enables efficient defect detection, aiding quality control in advanced ceramic component manufacturing.
Product Advantages
High-Precision Inspection：Equipped with a super-depth-of-field camera, it achieves imaging precision up to 0.4 μm, pixel accuracy of 2.6 μm at standard precision, and repeatability of ±1 μm, reliably capturing fine defects to meet stringent process requirements.
Large-Size Compatibility：Supports inspection of large ceramic sheets from 350 to 550 mm, accommodating large green sheets for electrostatic chucks and probe cards. Manual loading/unloading design flexibly adapts to production workflows.
Comprehensive Process Coverage：Provides comprehensive inspection items for various processes such as through-holes, via filling, printing, and bars, including foreign matter in holes, roundness, via dimples, via height, pattern shift, line width anomalies, and more, enabling one-stop full inspection.
Smart Zone Inspection：Supports DXF file import and customizable zone-based inspection strategies to optimize inspection efficiency, particularly suitable for complex pattern areas on large-size sheets.
Extremely Low False Positives and Missed Defects：Overkill rate is controlled within 0.1%, and missed detection rate is as low as 0.03%, ensuring accurate defect capture and minimizing the impact of misjudgment on production efficiency.
With Super Depth-of-Field Technology：Combined with super depth-of-field technology, it quickly identifies specific via height values, ensuring accurate defect capture and reducing the impact of uneven via height on the production process.
Product Functions
Product Specifications
- Maximum Inspection Size：
- 550mmSupports sheets from 350 to 550 mm
- Pixel Accuracy：
- 2.6μmStandard precision; up to 1 μm optional
- Repeatability：
- ±1μmPrecision levels supported
- Super Depth-of-Field Camera Imaging Precision：
- 0.4μm
- Inspection Speed：
- 3 min/pieceFor a 500 mm sheet as an example
- Overkill Rate / Missed Detection Rate：
- 0.1% / 0.03%Both are typical values
Applications
Green Sheet Inspection for Electrostatic Chucks：Applies to full appearance inspection after through-hole, via filling, and printing processes in electrostatic chuck manufacturing, ensuring hole position accuracy and via filling quality.
Green Sheet Inspection for Probe Cards：Performs high-precision inspection of micro through-holes, via filling, and printed patterns on probe card sheets, ensuring signal transmission reliability.
Large Ceramic Substrate Printing Inspection：Used for appearance defect inspection of printed circuits, electrode patterns, etc., such as breaks, continuity, and misalignment, suitable for large substrates from 350 to 550 mm.