Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
AMB, DBC, DPC Inspection Product Line
AMB001 Small Piece/Single Unit Inspection Equipment
The AMB small piece/single unit inspection equipment is specifically designed for AMB advanced ceramic substrates. It efficiently detects defects such as cracks, protrusions, missing areas, chipping, pattern misalignment, broken circuits, residual copper, solder assist, and oxidation, with a maximum pixel accuracy of 1 μm, repeat accuracy of ±1 μm, over-kill rate as low as 0.01%, and miss rate as low as 0.001%, meeting high-reliability inspection requirements.
Product Advantages
High-Precision Inspection：Supports the highest precision configuration with pixel accuracy of 1 μm and repeat accuracy of ±1 μm, and can be adjusted in levels according to needs, ensuring accurate identification of micro-defects.
Comprehensive Defect Coverage：Inspection items cover cracks, protrusions, missing areas, chipping, pattern misalignment, broken circuits, residual copper, solder assist, and oxidation, providing a one-stop solution for various defect detection needs.
Extremely Low False Call Rate：Over-kill rate as low as 0.01% and miss rate as low as 0.001% effectively reduce the risk of false calls and misses, improving production yield and efficiency.
High Inspection Efficiency：Inspection time for a single piece (65mm size product) is only 2.5 seconds, achieving high-speed inspection while maintaining precision, suitable for production line takt time.
Product Functions
Product Specifications
- Inspection Object：
- AMB, DBC, DPC small piece/single unit
- Pixel Accuracy：
- 1 μm / 5 μmSelectable between highest and standard accuracy
- Repeat Accuracy：
- ±1 μm / ±5 μmCorresponding to highest and standard accuracy
- Inspection Performance：
- Over-kill rate 0.01%, miss rate 0.001%May vary by defect type
- Inspection Efficiency：
- 2.5 sec/pieceFor 65mm size product as an example
Applications
AMB Substrate Inspection：Applicable for small piece/single unit inspection of AMB (Active Metal Brazing) substrates, effectively identifying critical defects such as cracks and oxidation.
DBC Substrate Inspection：Used for surface defect inspection of DBC (Direct Bonded Copper) substrates, ensuring pattern integrity and quality.
DPC Substrate Inspection：Targets DPC (Direct Plated Copper) substrates to detect process issues such as pattern misalignment and residual copper, enhancing product reliability.
Advanced Ceramic Component Production Line：Integrated into the quality inspection stage of advanced ceramic component production lines, enabling efficient online or offline inspection.