Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
AMB, DBC, DPC Inspection Product Line
DPC002 Full Panel / Full Sheet Inspection Equipment
The Full Panel / Full Sheet Inspection Equipment is specifically designed for full-panel inspection of DPC ceramic substrates. It employs high-precision AOI imaging technology to efficiently detect defects such as copper residue, shorts, fixed points, film thread adhesion, incomplete development, and oxidation discoloration. It supports precision grading to meet various process requirements. While ensuring high accuracy, the equipment also prioritizes inspection efficiency, helping to improve product quality and production yield.
Product Advantages
High-Precision Inspection：Supports a maximum pixel accuracy of 1 μm and repeatability of ±1 μm, with a common accuracy of 5 μm, enabling the detection of subtle defects and ensuring inspection reliability.
Multi-Defect Coverage：Detects common DPC process defects such as copper residue, shorts, fixed points, film thread adhesion, incomplete development, and oxidation discoloration, providing comprehensive product quality assurance.
Low Overkill and Miss Rate：The overkill rate is controlled at 1%, and the miss rate at 0.5% (slightly varying by defect type), effectively balancing detection rate and misjudgment rate to reduce waste and risk.
High-Speed Inspection：For products sized 76-101 mm, the inspection efficiency reaches 27 seconds per piece, balancing precision and speed to meet mass production demands.
Product Functions
Product Specifications
- Inspection Object：
- DPC full panel/sheet
- Maximum Accuracy：
- Pixel accuracy 1 μm, repeatability ±1 μmPrecision grading supported
- Common Accuracy：
- Pixel accuracy 5 μm, repeatability ±5 μmThe following data is calculated based on the common accuracy
- Overkill Rate：
- 1%May vary by defect type
- Miss Rate：
- 0.5%May vary by defect type
- Inspection Efficiency：
- 27 sec/pieceFor products sized 76-101 mm
Applications
DPC Ceramic Substrate Production：Used for full-panel inspection in DPC processes, real-time monitoring of defects such as copper residue and shorts to improve product yield.
AMB/DBC Substrate Inspection：Suitable for full-sheet appearance inspection of AMB (Active Metal Brazing) and DBC (Direct Bonded Copper) substrates, ensuring substrate quality.
Advanced Ceramic Component Manufacturing：Rapid screening of full-panel ceramic substrates on advanced ceramic component production lines, reducing the risk of defective products flowing out.