Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
HTCC / LTCC Finished Product Line
FP002 Appearance Inspection Equipment (Finished Packages)
The FP series appearance inspection equipment is purpose-built for finished ceramic packages. A 360° rotating axis enables multi-angle, full-coverage inspection and accurately identifies scratches, cracks, chipping, and other tiny defects. With high precision, high efficiency, and an extremely low false-call rate, it is the ideal choice for quality assurance of advanced ceramic components.
Product Advantages
Full-Angle Coverage Inspection：Equipped with a 360° rotating axis for rotation at any angle, enabling multi-angle, full-coverage inspection of various ceramic packages such as those with lead frames, leads, or optical windows—with no blind spots.
High-Precision Imaging System：Featuring a high-resolution camera with 2.1 μm pixel accuracy and 10 μm inspection accuracy, it effectively identifies sub-millimeter defects to ensure no tiny flaw goes undetected.
Comprehensive Defect Detection：Covers more than 20 defect types, including scratches, cracks, pits and bumps, chipping, bubbles, gold-layer peeling, contamination, overflow, foreign matter, flatness, discoloration, missed plating, burrs, chipping loss, delamination, voids, solder accumulation, misalignment, and in-cavity defects—meeting diverse workpiece inspection needs.
Extremely Low False Calls and Escapes：Advanced algorithm optimization achieves an overkill rate of just 0.1% and an escape rate as low as 0.01%, ensuring reliability while significantly reducing manual re-inspection costs.
High-Efficiency Inspection Cycle：A single-piece inspection cycle takes only 5 seconds (based on inspecting 11 surfaces of an optical-communication package), balancing high precision with high throughput to match line takt requirements.
Product Functions
Product Specifications
- Inspection Target：
- Finished ceramic packages (with lead frames, leads, optical windows, etc.)
- Pixel Accuracy：
- 2.1 μm
- Inspection Accuracy：
- 10 μm
- Overkill Rate：
- 0.1%False-call rate
- Escape Rate：
- 0.01%
- Inspection Efficiency：
- 5 s/pcsBased on an optical-communication package inspecting 11 surfaces
Applications
Optical Communication Devices：Suitable for surface defect inspection of optical-communication components such as optical-communication packages, ensuring high reliability and optical performance.
Semiconductor Packaging：Used for finished inspection of ceramic packages for semiconductor packaging, safeguarding packaging quality and electrical performance.
Electronic Components：Inspects housing defects of various ceramic electronic components, improving product consistency and service life.
Aerospace and Defense：Meets high-reliability requirements and is used to inspect ceramic package housings in aerospace, defense, and other fields, ensuring stability in extreme environments.