Heils Technology

Advanced Ceramic Components

Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.

HomeProducts & ServicesAdvanced Ceramic Components测试型号 Test Equipment
Test Equipment

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测试型号 Test Equipment

The high-precision laser processing test equipment is specifically designed for advanced ceramic components, supporting multi-station cooperative laser drilling to significantly improve processing efficiency and consistency. With stable and reliable performance, it meets the high standards of B2B industrial inspection equipment.

Product Advantages

01

Multi-Station Cooperative ProcessingSupports simultaneous operation of multiple stations, achieving efficient laser drilling through coordinated control, greatly reducing production cycle time.

02

High-Precision PositioningEmploys a precision motion stage and vision alignment system to ensure hole position accuracy at the micron level, meeting stringent tolerance requirements for ceramic components.

03

Stable Laser SourceEquipped with an industrial-grade laser, providing stable output energy and adjustable pulse width, suitable for ceramic processing of various thicknesses and materials.

04

Intelligent Monitoring and FeedbackReal-time monitoring of processing parameters, automatic deviation compensation to ensure batch consistency, and supports data traceability.

Product Functions

Product Specifications

Number of Stations
2-4Optional based on configuration
Positioning Accuracy
±5 μm
Laser Wavelength
355 nmOther wavelengths customizable
Max Processing Size
300 × 300 mm
Processing Efficiency
>100 holes/minDepends on hole diameter and material

Applications

Ceramic Substrate DrillingApplicable for precision through-hole and blind-hole processing of ceramic substrates such as alumina and aluminum nitride, used in electronic packaging and heat dissipation structures.

Micro-Hole Processing for Ceramic Structural ComponentsMeets the micro-hole array processing needs of complex structures like ceramic nozzles and insulators, with controllable hole diameter range of 50-500 μm.