Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
Vision Inspection
TKF500 Glass Substrate Surface Inspection System
The TKF500 Glass Substrate Surface Inspection System is designed for high-precision visual inspection, capable of rapid full inspection of numerous micro-holes in a single pass with an accuracy of ±5 μm. It is suitable for surface defect and dimensional measurement of glass and advanced ceramic components.
Product Advantages
High-Speed Multi-Hole Simultaneous Inspection：Utilizes parallel optical imaging and a high-speed scanning mechanism to fully inspect hundreds of micro-holes in a single scan, significantly increasing production throughput.
Micron-Level Measurement Accuracy：Inspection accuracy is strictly controlled at ±5 μm, meeting the high-standard dimensional measurement requirements of semiconductor packaging and advanced ceramics.
Intelligent Defect Recognition：Integrates deep learning algorithms to accurately identify subtle defects such as cracks, chipping, and hole wall roughness, reducing false rejection rates.
Flexible Substrate Compatibility：Accommodates glass and ceramic substrates of various sizes and thicknesses, enabling quick changeover for multi-variety production requirements.
Integrated Data Management：Automatically generates inspection reports and SPC statistics, supports MES integration, and enables quality traceability throughout the production process.
Product Functions
Product Specifications
- Inspection Accuracy：
- ±5 μm
- Inspection Speed：
- ≥500 mm²/sTypical value, may vary slightly with substrate complexity
- Max Substrate Size：
- Up to 500 mm × 500 mmCustomizable for larger sizes
- Min Detectable Hole Diameter：
- 10 μmDepends on optical system configuration
- Vision System：
- High-magnification dual-telecentric lens + high-resolution industrial camera
- Equipment Dimensions：
- Approx. 2000 mm × 1500 mm × 1800 mmIncludes loading/unloading module
Applications
Display Panel Glass Substrates：Inspects through-holes and blind vias on TFT-LCD and OLED substrates for dimensional accuracy and edge defects, ensuring pixel-level reliability.
Semiconductor Package Substrates：Performs comprehensive inspection of micro-hole arrays on IC carriers and interposers, ensuring consistency of conductive vias.
Advanced Ceramic Components：Suitable for surface quality and micro-hole parameter inspection of ceramic package bases, filters, and resonators.
Precision Screens and Molds：Inspects aperture area and shape errors of high-density screens, as well as hole position accuracy of precision molds.