Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
AMB, DBC, DPC Inspection Product Line
DPC001 DPC Through-Hole Inspection Equipment
This equipment is purpose-built for DPC through-hole inspection, employing high-precision AOI technology to automatically detect and compile statistics on key defects such as hole diameter, hole roundness, hole ceramic residue, hole taper, incomplete penetration, and hole cracks. With high precision, high efficiency, and high reliability, it meets the stringent quality inspection requirements of advanced ceramic component production.
Product Advantages
Ultra-High Inspection Precision：Supports pixel accuracy of 1μm and repeatability of ±1μm at maximum, with an optional depth-of-field camera enabling 50μm precision inspection, meeting DPC through-hole inspection needs at various levels.
Full Defect Coverage：Comprehensively covers key metrics including hole diameter, hole roundness, hole ceramic residue (foreign matter), hole taper, incomplete penetration, and hole cracks, while also supporting automatic statistics on NG hole regions, categories, and quantities.
Extremely Low False-Call Rate：Over-kill rate as low as 0.01% and escape rate as low as 0.001% (varies by defect type), effectively reducing losses caused by false calls and escapes.
High-Efficiency Inspection：Inspection time per piece is only 26 seconds (for 86-120mm products at the common precision of 60μm hole diameter), significantly improving production line inspection efficiency.
Product Functions
Product Specifications
- Inspection Target：
- DPC through-hole
- Maximum Precision：
- Pixel accuracy 1μm, repeatability ±1μmDepth-of-field camera precision 50μm
- Common Precision：
- Pixel accuracy 5μm, repeatability ±5μmThe performance data below is based on this precision
- Inspection Content：
- Hole diameter, hole roundness, hole ceramic residue (foreign matter), hole taper, incomplete penetration, hole cracksIncludes NG hole region/category/quantity statistics
- Inspection Performance：
- Over-kill rate 0.01%Escape rate 0.001%
- Inspection Efficiency：
- 26 sec/pieceApplicable to 86-120mm size, hole diameter 60μm
Applications
DPC Substrate Production：Used for through-hole quality inspection of DPC ceramic substrates, ensuring hole diameter dimensions and shapes meet design requirements and improving product reliability.
Defect Analysis and Process Monitoring：Real-time statistics on NG hole categories and quantities provide data support for process optimization and help pinpoint abnormal stages in production.
High-Density Interconnect Packaging：Suitable for through-hole inspection in high-density interconnect ceramic packaging, ensuring the processing quality of micro hole diameters.