Advanced Ceramic Components
Focused on semiconductor ceramic devices, the solution covers full-site testing, inspection, sorting, and repair to improve chip reliability.
Vision Inspection
H S T K 2000 Through-Hole Inspection Machine
Specifically designed for high-precision hole measurement after ceramic drilling, the Through-Hole Inspection Machine enables efficient and reliable inspection of hole diameter and position on HTCC, LTCC, and aluminum nitride substrates, supporting quality control in advanced ceramic component manufacturing.
Product Advantages
High-Precision Measurement：Utilizes advanced vision systems and algorithms to achieve micron-level inspection of hole diameter and position, ensuring compliance with stringent tolerance requirements.
Multi-Material Adaptability：Supports various ceramic substrates including HTCC, LTCC, and aluminum nitride, flexibly addressing different process needs.
Fast Inspection Speed：Integrates high-speed image acquisition and parallel processing units to significantly reduce per-part inspection cycles, meeting mass production takt times.
Intelligent Data Analysis：Generates real-time inspection reports and supports SPC statistical process control, providing data support for process optimization.
Stable and Reliable Architecture：Adopts industrial-grade modular design to withstand harsh production line environments, ensuring long-term operational stability.
Product Functions
Product Specifications
- Inspection Accuracy：
- ±2 μmDepends on substrate material and hole features
- Inspection Hole Diameter Range：
- 0.1-5.0 mmExpandable
- Inspection Speed：
- ≥20 holes/secContinuous inspection mode
- Applicable Substrate Size：
- Max 200×200 mmCustomizable
- Inspection Repeatability：
- ±1 μmUnder standard test conditions
- Machine Dimensions：
- 1200×1000×1800 mmExcluding electrical cabinet
Applications
HTCC Substrate Through-Hole Inspection：High-precision measurement of through-holes after high-temperature co-fired ceramic process, ensuring interlayer connection reliability.
LTCC Substrate Through-Hole Inspection：Inspects micro-hole position and size on low-temperature co-fired ceramic substrates, meeting high-frequency application requirements such as RF modules.
Aluminum Nitride Substrate Through-Hole Inspection：Applies to through-hole quality verification on aluminum nitride heat-dissipation substrates, ensuring power device packaging performance.
Ceramic Filter Through-Hole Inspection：Precision inspection of through-holes on ceramic filter green bodies and after sintering, improving product yield.